SAN JOSE, Calif. -- Singapore's Institute of Microelectronics (IME), a research group, has launched a consortium in 3-D packaging.
The so-called 10th Electronic Packaging Research Consortium (EPRC-10) will address key integration challenges of 3-D packaging and embedded module technologies. The consortium is a resource and cost sharing effort for electronics packaging research and development.
IME is spearheading the consortium with 16 company members that include Asahi Glass, ASM
Technology Singapore, Chartered Semiconductor Manufacturing, Compass Technology, Disco Hi-Tec Singapore, EVG Group, Ibiden Singapore, Infineon, Kinergy, Nepes, NXP, Shanghai Sinyang Semiconductor Materials, Silecs Oy, Sumitomo Bakelite Singapore, and Tango Systems.
